Wire Bonder
August 11, 2025 07:59 PM
Semi-auto/manual, supports Al, Au, Cu wires (17–75 µm)
Equipment Images:
Manufacturer / Vendor:
MP iBond5000 w/ Olympus microscope
Model:
iBond5000
Building:
Room Number:
0002
Functionality:
Applications:
Wire bonding for microdevices and physical property measurement
Custodian Department / Unit:
Point of Contact Name:
Dr. Muhammed Razi Paleth
Point of Contact Email:
Status:
